Chukoh Chemical Industries, Ltd. products

The CGP-500A is a copper-clad laminate incorporating a fluoroplastic-impregnated glass cloth as its dielectric base. This combination maintains the inherent properties of fluoroplastics, ensuring a stable dielectric constant across a broad frequency spectrum, alongside a notably low dielectric loss tangent in high-frequency environments. The product is engineered to offer high peel strength, minimal water absorption, and robust through-hole processability, ensuring high dimensional stability and mechanical integrity. Its applications are extensive, covering satellite communications, mobile communication systems, CPU technologies, and local wireless communication networks. With a dielectric constant set at 2.6 and certification under UL, the CGP-500A is equipped with a standard copper foil thickness of 1/2 oz or 1 oz, offering flexibility in customization for specific technical requirements.