F&S BONDTEC Semiconductor GmbH products

BAMFIT (Bondtec Accelerated Mechanical Fatigue Interconnection Test) is a completely new test method for estimating bond life and reliability of heavy wire wedge bonds. It is the perfect extension of the classic Power Cycling Test (PC): the cyclic stress of the wire bond due to temperature cycling is replicated by mechanical stress, but with significantly higher cycle speed. This allows PC tests, often lasting weeks or months, to be simulated within minutes.