Leader Biomedical Group
eTiss - Bone Void Fillers for Bone Loss and Defect Correction
Cancellous and cortical bone chips with sound structural and mechanical properties for filling of bone loss and/or correcting of defects.
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- eCOO® Technology processing ensures excellent osteoconductive properties
- Forms stable complex with patient’s adjacent bone
- Wide variety of general orthopaedic, spinal, and dental applications