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Laser micromachining systems for SSAIL Industry - Electronics and Computers
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High-resolution conductive traces can be formed on polymers, glass, ceramics, and other dielectric materials. Trace width can go below 5 µm. With a patented SSAIL technology conductive traces can be formed on many standard dielectric materials (polymers, ceramics, glass, silicon). It enables tighter electronics packaging on flat or 3D surfaces (with traces down to 1 µm width), making antennas directly on/in parts and creating functional surfaces.
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HOW DOES IT WORK
SSAIL is a two-step process:
- Laser activation of the surface for traces. It is done by scanning the surface with a laser beam.
- After the laser activation, the part goes through a chemical process:
- Chemical activation is done with a special solution, which prepares laser-activated areas for electroless plating.
- Electroless plating with copper and passivation layers (nickel, silver, gold).
FLEXIBILITY OF SHAPES
Using SSAIL technology electrical traces can be used on different types of parts:
- 3D surfaces
- Thin films
- Flexible materials
- Through via plating
On most materials, a trace width of 15 µm can be achieved (down to 1 µm on some materials). Areas of square centimeters can be activated fast.
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