VIEW Micro Metrology applications

Quad Flat Pack (QFP) and Ball Grid Array (BGA) components represent metrology challenges with very tight tolerances that can tax the capabilities of even high performance systems. Coplanarity, lead width, pitch, ball diameter, package height and warpage, and the need to inspect for damaged or missing balls/leads can all be critical factors. In addition to the needs for versatile lighting and high-performance image processing, effective QFP/BGA inspection also requires integrated laser capabilities for rapid and accurate Z-axis measurements.

Flex circuit technologies pose a wide range of metrology challenges with a large number of different circuit geometries, pitch dimensions, and surface reflectivity factors. To meet these challenges, metrology systems for flex circuit inspection must incorporate advanced functionality such as versatile lighting, large-size stages, high-resolution positioning, and very accurate laser probe capabilities.