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VIA DBM - Model Plus - Demineralized Bone Matrix Putty Containing Bone Chips
VIA DBM Plus™ is a demineralized bone matrix putty containing cortical bone chips and indicated for use in the extremities, posterolateral spine, and pelvis as a bone void filler or for treatment of osseous defects.
EQUIVALENT TO ILIAC CREST AUTOGRAFT
proven in a preclinical spinal fusion model1
ASSURED OSTEOINDUCTIVITY
via validated processing
COHESIVE HANDLING
Resists irrigation due to robust biocompatible carrier
VIA DBM Plus™ combines demineralized cortical chips (1-4mm) with the proven formulation of VIA DBM Putty™, eliminating the need for cumbersome intra-operative mixing. Utilizing demineralized instead of mineralized cortical chips ensures that the additional graft material does not diminish osteoinductivity. VIA DBM Plus has excellent handling properties and a 510(k) designation from the FDA.
PREPARATION TIME
None. Product is provided pre-mixed and ready-to-use.
SHELF LIFE
Up to 3 years (at ambient temperature of 15°C to 30°C)
PRODUCT COMPOSITION
Cortical demineralized bone and a carboxymethyl cellulose (CMC) carrier plus demineralized cortical chips (1-4mm)
FINAL PREPARATION
Final product is provided in a ready-to-use syringe.
SIZE: CODE
- 3.0cc: VX-EP3
- 5.0cc: VX-EP5
- 10.0cc: VX-EP10