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Encapsulation Technology

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Customized Encapsulation Technology for your Implant. CorTec is offering a wide spectrum of services accompanying you all the way through the development of innovative technologies leading to an approved medical device in the end. Our CorTec Encapsulation Technologies enable us to develop customized solutions for your specific requirements. We offer hermetically sealed encapsulations as well as non-hermetic solutions, like overmoulding technologies. Thanks to our development process and modern production technologies our team of highly skilled and experienced engineers can rapidly implement your design ideas and provide you with silicone moulding prototypes faster.
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High Channel Count

Thick film technology enables hundreds of electrical feedthroughs — unlike conventional titanium packages with metal pin feedthroughs.

Electromagnetic Transparency

The ceramic encapsulation is transparent to electromagnetic waves facilitating communication via radio frequency or infrared as well as inductive powering.

Superior Hermeticity
Protection of electronics against moisture works 10 times longer compared to standard titanium packages — even for small implant volumes below 1 cm3. Lifetime is extendable by additional application of desiccants.
Freedom of Design

CorTec´s ceramic encapsulations allow application-specific shapes and designs.

Functionalization

Creation of electrical feedthroughs and insulating layers via hybrid thick film technology.

High Protection

Protecting the electronics from moisture via hermetic solder-sealing.

Biocompatibility

Ensure biocompatibility via customized, void-free silicone overmoulds, also offering low humidity levels due to low leak rates and application of water getters.

Freedom of Design

CorTec´s non-hermetic encapsulations allow application-specific shapes and designs.

Dimensions

Geometry

  • Circular, oval, or rounded-edge rectangular designs
  • Ceramic packages are molded in silicone rubber in application-specific shapes

Dimensions

  • Minimum height: 2 mm
  • Variable lateral dimensions: maximum footprint of 80 mm x 80 mm

Feedthrough Dimensions and Spacing

  • Feedthroughs come as metal tracks on ceramic base substrate
  • Minimum track width: 0.08 mm
  • Minimum pitch: 0.2 mm
  • Minimum pad area: 0.1 mm x 0.5 mm
Sealing

Hermetic Sealing in Controlled Helium Environment

  • Elaborated cleaning & drying procedure minimizes trapping of water molecules inside the package before sealing
  • Packages are sealed in 100% helium atmosphere permitting the best possible lifetime prediction based on helium leakage measurements
Customized Telemetric Coils
  • Hand-crafted high precision coils
  • Materials: Gold or copper
  • Up to 50 windings
  • Adaptation to the needs of customer-specific inductive power and data interfaces

Medical Grade Silicone Rubber Shell

  • Customized void-free silicone molding
  • Structural and surface biocompatibility
Connection to other products
  • AirRay™ electrodes
  • Commercially available implantable connectors