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Encapsulation Technology
Thick film technology enables hundreds of electrical feedthroughs — unlike conventional titanium packages with metal pin feedthroughs.
The ceramic encapsulation is transparent to electromagnetic waves facilitating communication via radio frequency or infrared as well as inductive powering.
CorTec´s ceramic encapsulations allow application-specific shapes and designs.
Creation of electrical feedthroughs and insulating layers via hybrid thick film technology.
Protecting the electronics from moisture via hermetic solder-sealing.
Ensure biocompatibility via customized, void-free silicone overmoulds, also offering low humidity levels due to low leak rates and application of water getters.
CorTec´s non-hermetic encapsulations allow application-specific shapes and designs.
Geometry
- Circular, oval, or rounded-edge rectangular designs
- Ceramic packages are molded in silicone rubber in application-specific shapes
Dimensions
- Minimum height: 2 mm
- Variable lateral dimensions: maximum footprint of 80 mm x 80 mm
Feedthrough Dimensions and Spacing
- Feedthroughs come as metal tracks on ceramic base substrate
- Minimum track width: 0.08 mm
- Minimum pitch: 0.2 mm
- Minimum pad area: 0.1 mm x 0.5 mm
Hermetic Sealing in Controlled Helium Environment
- Elaborated cleaning & drying procedure minimizes trapping of water molecules inside the package before sealing
- Packages are sealed in 100% helium atmosphere permitting the best possible lifetime prediction based on helium leakage measurements
- Hand-crafted high precision coils
- Materials: Gold or copper
- Up to 50 windings
- Adaptation to the needs of customer-specific inductive power and data interfaces
Medical Grade Silicone Rubber Shell
- Customized void-free silicone molding
- Structural and surface biocompatibility
- AirRay™ electrodes
- Commercially available implantable connectors